eSUN ePLA+HS High Speed Filament 1.75mm 1kg

eSUN ePLA+HS is a next-generation high-speed PLA+ filament engineered for modern fast printers like the Bambu Lab P1S, H2D, Creality K1, and K1 Max. Unlike standard PLA, ePLA+HS balances melt flow and cooling rate to achieve smooth, clog-free extrusion at speeds up to 500mm/s — without sacrificing print quality or mechanical strength.

Key Features

• Print Speed: 50–300mm/s normal, up to 500mm/s maximum
• Diameter: 1.75mm ± 0.03mm
• Spool Weight: 1kg (cardboard eco-spool)
• Nozzle Temperature: 210–230°C (recommended 215°C)
• Bed Temperature: 45–60°C
• Tensile Strength: 60MPa
• Elongation at Break: 18.3%
• Density: 1.23 g/cm³
• Stronger resilience — tougher than standard PLA, not brittle
• Smooth flow without clogging — fast cooling, no deformation
• AMS Compatible — cardboard spool adapter STL available for Bambu Lab AMS users
• Eco-friendly packaging — recyclable cardboard spool, vacuum-sealed

Compatible Printers

Bambu Lab X1C, P1S, H2D, A1 · Creality K1, K1C, K1 Max, K2 Pro · AnkerMake M5 · Most FDM printers supporting 1.75mm filament

Who Is It For?

ePLA+HS is the ideal upgrade for anyone with a high-speed printer who wants to push their machine to its limits without compromising on part quality. Perfect for rapid prototyping, concept models, functional parts, and everyday printing at maximum speed.