eSUN ePLA+HS is a next-generation high-speed PLA+ filament engineered for modern fast printers like the Bambu Lab P1S, H2D, Creality K1, and K1 Max. Unlike standard PLA, ePLA+HS balances melt flow and cooling rate to achieve smooth, clog-free extrusion at speeds up to 500mm/s — without sacrificing print quality or mechanical strength.
Key Features
- Print Speed: 50–300mm/s normal, up to 500mm/s maximum
- Diameter: 1.75mm ± 0.03mm
- Spool Weight: 1kg (cardboard eco-spool)
- Nozzle Temperature: 210–230°C (recommended 215°C)
- Bed Temperature: 45–60°C
- Tensile Strength: 60MPa
- Elongation at Break: 18.3%
- Density: 1.23 g/cm³
- Stronger resilience — tougher than standard PLA, not brittle
- Smooth flow without clogging — fast cooling, no deformation
- AMS Compatible — cardboard spool adapter STL available for Bambu Lab AMS users
- Eco-friendly packaging — recyclable cardboard spool, vacuum-sealed
Compatible Printers
Bambu Lab X1C, P1S, H2D, A1 · Creality K1, K1C, K1 Max, K2 Pro · AnkerMake M5 · Most FDM printers supporting 1.75mm filament
Who Is It For?
ePLA+HS is the ideal upgrade for anyone with a high-speed printer who wants to push their machine to its limits without compromising on part quality. Perfect for rapid prototyping, concept models, functional parts, and everyday printing at maximum speed.
